HomeStore
APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz
APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz
Features:
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
$7.21
Original: $24.03
-70%APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz—
$24.03
$7.21APU GPU BGA reballing Stencil set for Nintendo Wii rework template replacement - 4 peice | ZedLabz
Features:
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Features:
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
- Direct heat rework template for Nintendo Wii GPU CPU BGA.
- Includes 4 pieces.
- For 0.6 solder balls (0.50mm for CPU).
- Recommended for use by experienced engineers only.
Description:
A stencil template for the Nintendo Wii console GPU CPU BGA allows the precise reballing of the chip for rework jobs, ideal for fixing various motherboard faults.
